Kim, Cheolgyu: search on Z-Library

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1

Fast and accurate method of lifetime estimation for HfSiON/SiO 2 dielectric n -MOSFETs under positive bias temperature instability

Roh, Giyoun, Kim, Hyeokjin, Kim, Cheolgyu, Kim, Dongwoo, Kang, Bongkoo

Journal:

Microelectronics Reliability

Year:

2017

Language:

english

File:

PDF, 1.21 MB

english, 2017

2

Enhanced degradation of n-MOSFETs with high-k/metal gate stacks under channel hot-carrier/gate-induced drain leakage alternating stress

Dongwoo Kim, Seonhaeng Lee, Cheolgyu Kim, Chiho Lee, Jeongsoo Park, Bongkoo Kang

Journal:

Microelectronics Reliability

Year:

2012

Language:

english

File:

PDF, 212 KB

english, 2012

3

Mechanism of warpage orientation rotation due to viscoelastic polymer substrates during thermal processing

Kim, Cheolgyu, Lee, Tae-Ik, Kim, Min Sung, Kim, Taek-Soo

Journal:

Microelectronics Reliability

Year:

2017

Language:

english

File:

PDF, 2.77 MB

english, 2017

4

Voltage dependent degradation of HfSiON/SiO2 nMOSFETs under positive bias temperature instability

Kim, Cheolgyu, Kim, Hyeokjin, Kang, Bongkoo

Journal:

Microelectronics Reliability

Year:

2014

Language:

english

File:

PDF, 428 KB

english, 2014

5

Channel width dependence of mechanical stress effects induced by shallow trench isolation on device performance of nanoscale nMOSFETs

Seonhaeng Lee, Dongwoo Kim, Cheolgyu Kim, Chiho Lee, Jeongsoo Park, Bongkoo Kang

Journal:

Microelectronics Reliability

Year:

2012

Language:

english

File:

PDF, 687 KB

english, 2012

6

Excavator tele-operation system using a human arm

Dongmok Kim, Jongwon Kim, Kyouhee Lee, Cheolgyu Park, Jinsuk Song, Deuksoo Kang

Journal:

Automation in Construction

Year:

2009

Language:

english

File:

PDF, 3.48 MB

english, 2009

7

Effect of negative bias temperature instability induced by a low stress voltage on nanoscale high-k/metal gate pMOSFETs

Lee, Seonhaeng, Kim, Cheolgyu, Kim, Hyeokjin, Kim, Gang-Jun, Seo, Ji-Hoon, Son, Donghee, Kang, Bongkoo

Journal:

Microelectronics Reliability

Year:

2013

Language:

english

File:

PDF, 770 KB

english, 2013

8

Effect of electron–electron scattering at an elevated temperature on device lifetime of nanoscale nMOSFETs

Seonhaeng Lee, Dongwoo Kim, Cheolgyu Kim, N.-H. Lee, G.-J. Kim, Chiho Lee, Jeongsoo Park, Bongkoo Kang

Journal:

Microelectronics Reliability

Year:

2012

Language:

english

File:

PDF, 208 KB

english, 2012

9

Effects of film thickness and Sn concentration on electrical properties of solution-processed zinc tin oxide thin film transistors

Kim, CheolGyu, Lee, Nam-Hyun, Kwon, Young-Kyu, Kang, Bongkoo

Journal:

Thin Solid Films

Year:

2013

Language:

english

File:

PDF, 749 KB

english, 2013

10

Flash-Induced Stretchable Cu Conductor via Multiscale-Interfacial Couplings

Park, Jung Hwan, Seo, Jeongmin, Kim, Cheolgyu, Joe, Daniel J., Lee, Han Eol, Im, Tae Hong, Seok, Jae Young, Jeong, Chang Kyu, Ma, Boo Soo, Park, Hyung Kun, Kim, Taek-Soo, Lee, Keon Jae

Journal:

Advanced Science

Year:

2018

Language:

english

File:

PDF, 3.36 MB

english, 2018

11

Measurement of mechanical stresses induced by hybrid shallow-trench-isolation for dynamic random access memory using recess channel array transistor structure

Seonhaeng Lee, Dongwoo Kim, Cheolgyu Kim, T.K. Oh, S.Y. Cha, S.J. Hong, Bongkoo Kang

Journal:

Microelectronic Engineering

Year:

2012

Language:

english

File:

PDF, 684 KB

english, 2012

12

Mechanical Stability Analysis via Neutral Mechanical Plane for High-Performance Flexible Si Nanomembrane FDSOI Device

Kim, Seung-Yoon, Bong, Jae Hoon, Kim, Cheolgyu, Hwang, Wan Sik, Kim, Taek-Soo, Cho, Byung Jin

Journal:

Advanced Materials Interfaces

Year:

2017

Language:

english

File:

PDF, 1.76 MB

english, 2017

13

[IEEE 2017 International Conference on Electronics Packaging (ICEP) - Yamagata, Japan (2017.4.19-2017.4.22)] 2017 International Conference on Electronics Packaging (ICEP) - Effect of anisotropic mechanical properties of woven composite substrates on warpage orientation of printed circuit boards

Lee, Tae-Ik, Kim, Cheolgyu, Pyo, Jae-Bum, Kim, Min Sung, Kim, Taek-Soo

Year:

2017

Language:

english

File:

PDF, 312 KB

english, 2017

14

Wireless Powered Wearable Micro Light-Emitting Diodes

Lee, Han Eol, Lee, Daewon, Lee, Tae-Ik, Shin, Jung Ho, Choi, Gwang-Mun, Kim, Cheolgyu, Lee, Seung Hyung, Lee, Jae Hee, Kim, Yong Ho, Kang, Seung-Mo, Park, Sang Hyun, Kang, Il-Suk, Kim, Taek-Soo, Bae,

Journal:

Year:

2018

Language:

english

File:

PDF, 1.88 MB

english, 2018

15

[IEEE 2014 IEEE 64th Electronic Components and Technology Conference (ECTC) - Orlando, FL, USA (2014.5.27-2014.5.30)] 2014 IEEE 64th Electronic Components and Technology Conference (ECTC) - Methodology development of warpage analysis of polymer based packaging substrate

Kim, Cheolgyu, Lee, Taeik, Choi, Hyeseon, Kim, Min Sung, Kim, Taek-Soo

Year:

2014

Language:

english

File:

PDF, 2.74 MB

english, 2014

16

Prediction of time-dependent swelling of flexible polymer substrates using hygro-mechanical finite element simulations

Pyo, Jae-Bum, Lee, Tae-Ik, Kim, Cheolgyu, Kim, Min Sung, Kim, Taek-Soo

Journal:

Year:

2016

Language:

english

File:

PDF, 2.66 MB

english, 2016

17

Flexural and tensile moduli of flexible FR4 substrates

Lee, Tae-Ik, Kim, Cheolgyu, Kim, Min Sung, Kim, Taek-Soo

Journal:

Polymer Testing

Year:

2016

Language:

english

File:

PDF, 2.29 MB

english, 2016

18

Nanotransplantation Printing of Crystallographic-Orientation-Controlled Single-Crystalline Nanowire Arrays on Diverse Surfaces

Han, Hyeuk Jin, Jeong, Jae Won, Yang, Se Ryeun, Kim, Cheolgyu, Yoo, Hyeon Gyun, Yoon, Jun-Bo, Park, Jae Hong, Lee, Keon Jae, Kim, Taek-Soo, Kim, Seong-Woong, Jung, Yeon Sik

Journal:

Year:

2017

Language:

english

File:

PDF, 7.83 MB

english, 2017

19

Reversible self-bending soft hydrogel microstructures with mechanically optimized designs

Kim, Jongmin, Kim, Cheolgyu, Song, YoungShin, Jeong, Seong-Geun, Kim, Taek-Soo, Lee, Chang-Soo

Journal:

Chemical Engineering Journal

Year:

2017

Language:

english

File:

PDF, 4.60 MB

english, 2017

20

Mechanical and Electrical Reliability Analysis of Flexible Si Complementary Metal-Oxide-Semiconductor Integrated Circuit

Kim, Seungyoon, Kim, Cheolgyu, Bong, Jae Hoon, Hwang, Wan Sik, Kim, Taek-Soo, Oh, Jae Sub, Cho, Byung Jin

Journal:

Journal of Nanoscience and Nanotechnology

Year:

2019

File:

PDF, 7.81 MB

2019

21

Boron Nitride FIlms: DesolvationâTriggered Versatile TransferâPrinting of Pure BN Films with ThermalâOptical Dual Functionality (Adv. Mater. 38/2020)

Han, Yujin, Han, Hyeuk Jin, Rah, Yoonhyuk, Kim, Cheolgyu, Kim, Moohyum, Lim, Hunhee, Ahn, Kwang Ho, Jang, Hanhwi, Yu, Kyoungsik, Kim, TaekâSoo, Cho, Eugene N., Jung, Yeon Sik

Journal:

Advanced Materials

Year:

2020

File:

PDF, 3.74 MB

2020

22

A quantitative strain analysis of a flexible single-crystalline silicon membrane

Bong, Jae Hoon, Kim, Cheolgyu, Hwang, Wan Sik, Kim, Taek-Soo, Cho, Byung Jin

Journal:

Applied Physics Letters

Year:

2017

Language:

english

File:

PDF, 987 KB

english, 2017

23

[IEEE 2017 International Conference on Electronics Packaging (ICEP) - Yamagata, Japan (2017.4.19-2017.4.22)] 2017 International Conference on Electronics Packaging (ICEP) - FEM simulation of warpage orientation change of FRP polymer substrate during thermal processing

Kim, Cheolgyu, Lee, Tae-Ik, Kim, Min Sung, Kim, Taek-Soo

Year:

2017

Language:

english

File:

PDF, 299 KB

english, 2017

24

Effect of anisotropic thermo-elastic properties of woven-fabric laminates on diagonal warpage of thin package substrates

Lee, Tae-Ik, Kim, Cheolgyu, Pyo, Jae-Bum, Kim, Min Sung, Kim, Taek-Soo

Journal:

Composite Structures

Year:

2017

Language:

english

File:

PDF, 1.38 MB

english, 2017

25

Control of Reversible Self-Bending Behavior in Responsive Janus Microstrips

Oh, Myung Seok, Song, Young Shin, Kim, Cheolgyu, Kim, Jongmin, You, Jae Bem, Kim, Taek-Soo, Lee, Chang-Soo, Im, Sung Gap

Journal:

ACS Applied Materials & Interfaces

Year:

2016

Language:

english

File:

PDF, 2.20 MB

english, 2016

26

Artificial Skin: HumanâPalmâInspired Artificial Skin Material Enhances Operational Functionality of Hand Manipulation (Adv. Funct. Mater. 25/2020)

Heo, SiâHwan, Kim, Cheolgyu, Kim, TaekâSoo, Park, HyungâSoon

Journal:

Advanced Functional Materials

Year:

2020

File:

PDF, 1010 KB

2020

27

Saturation of threshold-voltage shift during positive bias temperature instability in HfSiON/SiO 2 n-channel MOSFET and its effect on device lifetime evaluation

Kim, Cheolgyu, Kim, Hyeokjin, Lee, Seonhaeng, Park, Jeongsoo, Kang, Bongkoo

Journal:

Japanese Journal of Applied Physics

Year:

2014

Language:

english

File:

PDF, 780 KB

english, 2014

28

Correction: A three-dimensional metal grid mesh as a practical alternative to ITO

Jang, Sungwoo, Jung, Woo-Bin, Kim, Cheolgyu, Won, Phillip, Lee, Sang-Gil, Cho, Kyeong Min, Jin, Ming Liang, An, Cheng Jin, Jeon, Hwan-Jin, Ko, Seung Hwan, Kim, Taek-Soo, Jung, Hee-Tae

Journal:

Year:

2018

Language:

english

File:

PDF, 118 KB

english, 2018

29

Design of ultrathin OLEDs having oxide-based transparent electrodes and encapsulation with sub-mm bending radius

Kim, Eungjun, Kwon, Jeonghyun, Kim, Cheolgyu, Kim, Taek-Soo, Choi, Kyung Cheol, Yoo, Seunghyup

Journal:

Organic Electronics

Year:

2020

File:

PDF, 1.79 MB

2020

30

Warpage Analysis of Electroplated Cu Films on Fiber-Reinforced Polymer Packaging Substrates

Kim, Cheolgyu, Lee, Tae-Ik, Kim, Min, Kim, Taek-Soo

Journal:

Year:

2015

Language:

english

File:

PDF, 4.93 MB

english, 2015

31

Mechanical and Electrical Reliability Analysis of Flexible Si Complementary Metal-Oxide-Semiconductor Integrated Circuit

Kim, Seungyoon, Kim, Cheolgyu, Bong, Jae Hoon, Hwang, Wan Sik, Kim, Taek-Soo, Oh, Jae Sub, Cho, Byung Jin

Journal:

Journal of Nanoscience and Nanotechnology

Year:

2019

Language:

english

File:

PDF, 7.81 MB

english, 2019

32

HumanâPalmâInspired Artificial Skin Material Enhances Operational Functionality of Hand Manipulation

Heo, SiâHwan, Kim, Cheolgyu, Kim, TaekâSoo, Park, HyungâSoon

Journal:

Advanced Functional Materials

Year:

2020

File:

PDF, 4.39 MB

2020

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